Multiphysics characterization of polymer-filled through-silicon vias (PF-TSVs) for three-dimensional integration-Reference-Cited by-同舟云学术

Multiphysics characterization of polymer-filled through-silicon vias (PF-TSVs) for three-dimensional integration

Published:2018-04-24 Issue:4 Volume:31 Page:e2348
ISSN:0894-3370
Container-title:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
language:en
Short-container-title:Int J Numer Model

Author:

Jin Jing¹,Zhao Wen-Sheng²^ORCID,Wang Da-Wei¹,Zhou Liang³,Yin Wen-Yan⁴¹

Affiliation:

1. State Key Lab of MOI, College of Optical Science and Engineering; Zhejiang University; Hangzhou 310027 China

2. School of Electronics and Information; Hangzhou Dianzi University; Hangzhou 310018 China

3. Key Lab of Ministry of Education for Research of Design and EMC of High Speed Electronic Systems, School of Electronic Information and Electrical Engineering; Shanghai Jiao Tong University; Shanghai 200240 China

4. Innovation Institute of Electromagnetic Information and Electronic Integration, Zhejiang Provincial Key Lab of Advanced Micro-Nano Electronic Devices and Smart Systems; Zhejiang University; Hangzhou 310027 China

Funder

National Natural Science Foundation of China

Zhejiang Provincial NSFC

Science Challenge Project

Talent Project of Zhejiang Association for Science and Technology

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modelling and Simulation

Reference26 articles.

1. 3-D hyperintegration and packaging technologies for micro-nano systems;Lu;Proc IEEE,2009

2. High-density through silicon vias for 3-D LSIs;Koyanagi;Proc IEEE,2009

3. Compact AC modeling and performance analysis of through-silicon vias in 3-D ICs;Xu;IEEE Trans Electron Devices,2010

4. Electrical modeling and characterization of shield differential through-silicon vias;Lu;IEEE Trans Electron Devices,2015

5. Electrical modeling and analysis of Cu-CNT heterogeneous coaxial through-silicon vias;Lu;IEEE Trans Nanotechnol,2017

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