Analysis of electromigration-induced failures in high-temperature sputtered Al-alloy metallization-Reference-Cited by-同舟云学术

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Analysis of electromigration-induced failures in high-temperature sputtered Al-alloy metallization

Published:1995-07 Issue:4 Volume:13 Page:1546
ISSN:0734-211X
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:
Short-container-title:J. Vac. Sci. Technol. B

Author:

Onoda Hiroshi

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced Wire Bonding Technology: Materials, Methods, and Testing;Materials for Advanced Packaging;2016-11-19

2. Microelectronic Packaging: Electrical Interconnections;Reference Module in Materials Science and Materials Engineering;2016

3. Advanced Wire Bonding Technology: Materials, Methods, and Testing;Materials for Advanced Packaging;2009

4. Microelectronic Packaging: Electrical Interconnections;Encyclopedia of Materials: Science and Technology;2001

5. In situ electron microscopy studies of electromigration in stacked Al(Cu)/TiN interconnects;Applied Physics Letters;2000-01-10

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