In situ electron microscopy studies of electromigration in stacked Al(Cu)/TiN interconnects
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.125690
Reference19 articles.
1. Electromigration and related failure mechanisms in integrated circuit interconnects
2. Temperature dependence of electromigration dynamics in Al interconnects by real-time microscopy
3. Temperature dependence of electromigration dynamics in Al interconnects by real-time microscopy
4. Temperature dependence of electromigration dynamics in Al interconnects by real-time microscopy
5. Behaviors of Precipitates, Voids, and Hillocks in Electromigration Stressed Al-2wt%Cu Interconnects
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3. Atomistic Breaking Processes via Electromigration in Platinum Nanocontacts;Journal of the Physical Society of Japan;2014-10-15
4. Current-Induced Transport: Electromigration;In-Situ Electron Microscopy;2012-04-24
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