Atomic layer etching of Si3N4 with high selectivity to SiO2 and poly-Si

Author:

Miyoshi Nobuya1ORCID,Shinoda Kazunori2,Kobayashi Hiroyuki1,Kurihara Masaru2,Kouzuma Yutaka3,Izawa Masaru4

Affiliation:

1. Hitachi High-Tech America, Inc., 6357 NE Evergreen Parkway, Building D, Hillsboro, Oregon 97124

2. Center for Technology Innovation-Instrumentation, Hitachi, Ltd., 1-280 Higashi-Koigakubo, Kokubunji-shi, Tokyo 185-8601, Japan

3. Nano-Technology Solution Business Group, Hitachi High-Tech Corp., 794 Higashitoyoi, Kudamatsu-shi, Yamaguchi 744-0002, Japan

4. Nano-Technology Solution Business Group, Hitachi High-Tech Corp., 1-17-1 Toranomon, Minato-ku, Tokyo 105-6409, Japan

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

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