Copper diffusion barrier properties of CVD boron carbo-nitride-Reference-Cited by-同舟云学术

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Copper diffusion barrier properties of CVD boron carbo-nitride

Published:2005 Issue:2 Volume:23 Page:463
ISSN:0734-211X
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:en
Short-container-title:J. Vac. Sci. Technol. B

Author:

Engbrecht E. R.,Sun Y.-M.,Junker K. H.,White J. M.,Ekerdt J. G.

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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