Resistivity changes and phase evolution in W–N films sputter deposited in Ne–N2 and Ar–N2 discharges
Author:
Publisher
American Vacuum Society
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://avs.scitation.org/doi/pdf/10.1116/1.575277
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3. Influence of process parameters on properties of reactively sputtered tungsten nitride thin films;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2012-05
4. Thermal stability of tungsten and tungsten nitride Schottky contacts to AlGaN/GaN;Chinese Physics B;2011-06
5. Effects of nitrogen concentration on microstructures of WNX films synthesized by cathodic arc method;Surface and Coatings Technology;2005-04
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