Dielectric etching for 0.18 μm technologies
Author:
Publisher
American Vacuum Society
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://avs.scitation.org/doi/pdf/10.1116/1.581127
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. On-wafer monitoring of charge accumulation and sidewall conductivity in high-aspect-ratio contact holes during SiO[sub 2] etching process;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2007
2. Modeling of magnetically enhanced capacitively coupled plasma sources: Two frequency discharges;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2007
3. Real-time monitoring of charge accumulation during pulse-time-modulated plasma;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2006-11
4. Simulations of magnetized capacitively coupled plasmas operating at constant power and voltage;Plasma Sources Science and Technology;2005-04-05
5. Mitigation of accumulated electric charge by deposited fluorocarbon film during SiO2 etching;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2004-03
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