Investigation of surface modifications of 193 and 248 nm photoresist materials during low-pressure plasma etching
Author:
Publisher
American Vacuum Society
Subject
General Engineering
Cited by 38 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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3. Reaction mechanisms between chlorine plasma and a spin-on-type polymer mask for high-temperature plasma etching;Japanese Journal of Applied Physics;2018-08-31
4. Dependence of absolute photon flux on infrared absorbance alteration and surface roughness on photoresist polymers irradiated with vacuum ultraviolet photons emitted from HBr plasma;Japanese Journal of Applied Physics;2017-11-15
5. Surface roughening of photoresist after change of the photon/radical and ion treatment sequence;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2017-11
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