Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools-Reference-Cited by-同舟云学术

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Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools

Published:2009 Issue:3 Volume:27 Page:1361
ISSN:1071-1023
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:en
Short-container-title:J. Vac. Sci. Technol. B

Author:

Liu Kui,Zuo Dunwen,Li X. P.,Rahman M.

Publisher

American Vacuum Society

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nonlinear vibration analysis in high speed milling of single crystal silicon considering dynamic cutting thickness;Nonlinear Dynamics;2024-07-01

2. Thermal analysis of in-situ laser assisted diamond cutting of fused silica and process optimization;Optics & Laser Technology;2024-05

3. Dissolution Behavior of Metal Impurities and Improvement of Reclaimed Semiconductor Wafer Cleaning by Addition of Chelating Agent;Archives of Metallurgy and Materials;2023-07-26

4. Nanosecond laser-induced controllable oxidation of TiB2–TiC ceramic composites for subsequent micro milling;Ceramics International;2022-01

5. Enhancing the ductile machinability of single-crystal silicon by laser-assisted diamond cutting;The International Journal of Advanced Manufacturing Technology;2021-10-12

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