Bottom-up fill mechanisms of electroless copper plating with addition of mercapto alkyl carboxylic acid-Reference-Cited by-同舟云学术

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Bottom-up fill mechanisms of electroless copper plating with addition of mercapto alkyl carboxylic acid

Published:2006 Issue:2 Volume:24 Page:803
ISSN:1071-1023
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:en
Short-container-title:J. Vac. Sci. Technol. B

Author:

Wang Zenglin,Liu Zhijuan,Jiang Hongyan,Wei Wang Xiu

Publisher

American Vacuum Society

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte;Journal of The Electrochemical Society;2022-09-01

2. Electroless copper deposition using 3 mercapto propionic acid as an additive;Materials Today: Proceedings;2021

3. New strategies for conformal, superconformal, and ultrasmooth films by low temperature chemical vapor deposition;Journal of Vacuum Science & Technology A;2020-05

4. 30 years of electroless plating for semiconductor and polymer micro-systems;Microelectronic Engineering;2015-01

5. Bottom-up filling in electroless plating with an addition of JGB-RPE;Russian Journal of Electrochemistry;2014-05

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