Effects of manganese oxide–mixed abrasive slurry on the tetraethyl orthosilicate oxide chemical mechanical polishing for planarization of interlayer dielectric film in the multilevel interconnection-Reference-Cited by-同舟云学术

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Effects of manganese oxide–mixed abrasive slurry on the tetraethyl orthosilicate oxide chemical mechanical polishing for planarization of interlayer dielectric film in the multilevel interconnection

Published:2008-07 Issue:4 Volume:26 Page:996-1001
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Seo Yong-Jin,Park Sung-Woo,Lee Woo-Sun

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.2936225

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Polishing of SiC films;Advances in Chemical Mechanical Planarization (CMP);2022

2. Effect of diluted colloidal silica slurry mixed with ceria abrasives on CMP characteristic;International Journal of Precision Engineering and Manufacturing-Green Technology;2016-01

3. Polishing of SiC films;Advances in Chemical Mechanical Planarization (CMP);2016

4. Shallow Trench Isolation Chemical Mechanical Planarization: A Review;ECS Journal of Solid State Science and Technology;2015

5. Effect of Transition Metal Compounds on Amorphous SiC Removal Rates;ECS Journal of Solid State Science and Technology;2014

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