Response surface study of resist etching in high density oxygen plasma and interactions of O2 plasma with NiFe, Cu, Ta, and Al2O3-Reference-Cited by-同舟云学术

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Response surface study of resist etching in high density oxygen plasma and interactions of O2 plasma with NiFe, Cu, Ta, and Al2O3

Published:1996-05 Issue:3 Volume:14 Page:1028-1032
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Hsiao R.,Miller D.,Kellock A.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.580127

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3. Combinatorial survey of fluorinated plasma etching in the silicon-oxygen-carbon-nitrogen-hydrogen system;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2016-11

4. Modification of edge mode dynamics by oxidation in Ni80Fe20 thin film edges;Journal of Applied Physics;2010-05-15

5. Surface nanostructures orienting self-protection of an orthodontic nickel-titanium shape memory alloys wire;Chinese Science Bulletin;2007-11

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