Rapid repair of plasma ash damage in low-k dielectrics using supercritical CO[sub 2]-Reference-Cited by-同舟云学术

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Rapid repair of plasma ash damage in low-k dielectrics using supercritical CO[sub 2]

Published:2004 Issue:3 Volume:22 Page:1210
ISSN:0734-211X
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:en
Short-container-title:J. Vac. Sci. Technol. B

Author:

Gorman B. P.,Orozco-Teran R. A.,Zhang Z.,Matz P. D.,Mueller D. W.,Reidy R. F.

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 48 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Modeling the Dynamics of the Integral Dielectric Permittivity of a Porous Low-K Organosilicate Film during the Dry Etching of a Photoresist in O2 Plasma;Russian Microelectronics;2018-11

3. High temperature water as a clean and etch of low-k and SiO2 films;Microelectronic Engineering;2018-09

4. Cryogenic Aerosols and Supercritical Fluid Cleaning and Surface Conditioning ∗;Handbook of Silicon Wafer Cleaning Technology;2018

5. Cellular-automata model of oxygen plasma impact on porous low-K dielectric;SPIE Proceedings;2016-12-30

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