Relationship of crystallographic orientation and impurities to stress, resistivity, and morphology for sputtered copper films-Reference-Cited by-同舟云学术

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Relationship of crystallographic orientation and impurities to stress, resistivity, and morphology for sputtered copper films

Published:1993-11 Issue:6 Volume:11 Page:2970-2974
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Burnett Andrew F.,Cech Jay M.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.578677

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