Author:
Keaton A. Landauer,Hess D. W.
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Cited by
22 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Highly selective and precisely controlled aluminum etching by Ar/HBr/CH3F/O2gas chemistry;Japanese Journal of Applied Physics;2014-01-01
2. Plasma etching: Yesterday, today, and tomorrow;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2013-09
3. SELECTIVE REMOVAL OF HIGH-KGATE DIELECTRICS;Chemical Engineering Communications;2009-08-31
4. Plasma etching of Hf-based high-k thin films. Part I. Effect of complex ions and radicals on the surface reactions;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2009-03
5. Metallization;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22