Solid source diffusion from agglomerating silicide sources. I. Measurement and modeling

Author:

Tsai J. Y.

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Abnormal junction profile of silicided p/sup +//n shallow junctions: a leakage mechanism;IEEE Electron Device Letters;2002-04

2. Abnormal Junction Profile of Submicrometer Complementary Metal Oxide Semiconductor Devices with Co Silicidation and Shallow Trench Isolation Processes;Electrochemical and Solid-State Letters;2001

3. Thermal stability of thin CoSi[sub 2] layers on polysilicon implanted with As, BF[sub 2], and Si;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1998-05

4. Diffusion from polymer spin-on films: Measurements and simulations;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1998-01

5. Metal Silicides: Active elements of ULSI contacts;Journal of Electronic Materials;1996-11

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