High aspect ratio Bosch etching of sub-0.25 μm trenches for hyperintegration applications-Reference-Cited by-同舟云学术

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High aspect ratio Bosch etching of sub-0.25 μm trenches for hyperintegration applications

Published:2007 Issue:4 Volume:25 Page:1376
ISSN:1071-1023
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:en
Short-container-title:J. Vac. Sci. Technol. B

Author:

Wang Xiaodong,Zeng Wanxue,Lu Guoping,Russo Onofrio L.,Eisenbraun Eric

Publisher

American Vacuum Society

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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