Three‐dimensional equipment modeling for chemical vapor deposition-Reference-Cited by-同舟云学术

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Three‐dimensional equipment modeling for chemical vapor deposition

Published:1996-05 Issue:3 Volume:14 Page:1147-1151
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Werner Christoph,Ilg Matthias,Uram Kevin

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.580285

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simulation and optimization of silicon thermal CVD through CFD integrating Taguchi method;Chemical Engineering Journal;2008-04-15

2. Multi-scale modeling of chemical vapor deposition processes for thin film technology;Journal of Crystal Growth;2007-05

3. Numerical Simulation of Flow and Chemistry in Thermal Chemical Vapor Deposition Processes;Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies;2002

4. Computational modeling of transport phenomena and detailed chemistry in chemical vapor deposition – a benchmark solution;Thin Solid Films;2000-04

5. Some recent developments in chemical vapor deposition process and equipment modeling;Le Journal de Physique IV;1999-09

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