Area selective CVD of metallic films from molybdenum, iron, and ruthenium carbonyl precursors: Use of ammonia to inhibit nucleation on oxide surfaces-Reference-Cited by-同舟云学术

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Area selective CVD of metallic films from molybdenum, iron, and ruthenium carbonyl precursors: Use of ammonia to inhibit nucleation on oxide surfaces

Published:2018-07 Issue:4 Volume:36 Page:041507
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A
language:en
Short-container-title:Journal of Vacuum Science & Technology A

Author:

Mohimi Elham¹,Zhang Zhejun V.¹,Liu Sumeng²,Mallek Justin L.³,Girolami Gregory S.²,Abelson John R.¹

Affiliation:

1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 W. Green St., Urbana, Illinois 61801

2. Department of Chemistry, University of Illinois at Urbana Champaign, 600 South Mathews Avenue, Urbana, Illinois 61801

3. MIT Lincoln Laboratory, 244 Wood Street, Lexington, Massachusetts 02420

Funder

National Science Foundation

Lincoln Laboratory, Massachusetts Institute of Technology

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/am-pdf/10.1116/1.5023236

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Area selective deposition for bottom-up atomic-scale manufacturing;International Journal of Machine Tools and Manufacture;2024-06

2. Selectivity and Growth Rate Modulations for Ruthenium Area‐selective Deposition by Co‐Reagent and Nanopattern Design;Advanced Materials Technologies;2024-01-12

3. The interaction of size-selected Ru₃ clusters with TiO₂: depth-profiling of encapsulated clusters;Physical Chemistry Chemical Physics;2024

4. Low-resistivity molybdenum obtained by atomic layer deposition;Journal of Vacuum Science & Technology A;2023-08-28

5. Aerosol-Assisted Chemical Vapor Deposition of MoS₂ with a Thiourea Sulfur Source: Single-Source Precursors vs Coreactant Mixtures;ACS Applied Materials & Interfaces;2023-07-26

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