Selective etching of GaN over AlN using an inductively coupled plasma and an O2/Cl2/Ar chemistry
Author:
Publisher
American Vacuum Society
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://avs.scitation.org/doi/pdf/10.1116/1.582270
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Hybrid simulation of radio frequency biased inductively coupled Ar/O<sub>2</sub>/Cl<sub>2</sub> plasmas;Acta Physica Sinica;2024
2. NH3/N2 plasma treatment on etched AlGaN surface for high-performance p-GaN HEMTs fabrication;Materials Science in Semiconductor Processing;2023-11
3. Suppression of Reverse Leakage in Enhancement‐Mode GaN High‐Electron‐Mobility Transistor by Extended PGaN Technology;physica status solidi (a);2023-05-31
4. Removal of GaN film over AlGaN with inductively coupled BCl3/Ar atomic layer etch;Chinese Physics B;2022-01-01
5. Selective etching of p-GaN over Al0.25Ga0.75N in Cl2/Ar/O2 ICP plasma for fabrication of normally-off GaN HEMTs;Materials Science in Semiconductor Processing;2021-02
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