Author:
Rowbotham T.,Patel J.,Lam T.,Abhulimen I. U.,Burkett S.,Cai L.,Schaper L.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics
Cited by
19 articles.
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1. Tutorial on forming through-silicon vias;Journal of Vacuum Science & Technology A;2020-05
2. Deep reactive ion etching;Handbook of Silicon Based MEMS Materials and Technologies;2020
3. Development of seed layer for electrodeposition of copper on carbon nanotube bundles;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2015-03
4. Deep Reactive Ion Etching;Handbook of Silicon Based MEMS Materials and Technologies;2015
5. Novel through silicon via exposure process comprising Si/Cu grinding, electroless Ni–B plating, and wet etching of Si;Japanese Journal of Applied Physics;2014-04-22