Microscratch testing method for systematic evaluation of the adhesion of atomic layer deposited thin films on silicon-Reference-Cited by-同舟云学术

Microscratch testing method for systematic evaluation of the adhesion of atomic layer deposited thin films on silicon

Published:2016-01 Issue:1 Volume:34 Page:01A124
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Kilpi Lauri,Ylivaara Oili M. E.,Vaajoki Antti,Malm Jari¹,Sintonen Sakari²,Tuominen Marko³,Puurunen Riikka L.,Ronkainen Helena

Affiliation:

1. Department of Physics, University of Jyväskylä, P.O. Box 35, Jyväskylä 40014, Finland

2. Department of Micro- and Nanosciences, Aalto University School of Electrical Engineering, P.O. Box 13500, FI-00076 AALTO, Finland

3. ASM Microchemistry Oy, Pietari Kalmin katu 1 F 2, FIN-00560 Helsinki, Finland

Funder

ASM Microchemistry Oy

Beneq Oy

Murata Electronics Oy

Okmetic Oyj

Oxford Instruments Analytical Oy

Picosun Oy

Tekes

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献