Cryogenic inductively coupled plasma etching for fabrication of tapered through-silicon vias-Reference-Cited by-同舟云学术

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Cryogenic inductively coupled plasma etching for fabrication of tapered through-silicon vias

Published:2010-07 Issue:4 Volume:28 Page:719-725
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Kamto A.,Divan R.,Sumant A. V.,Burkett S. L.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.3281005

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4. Dry etching in the presence of physisorption of neutrals at lower temperatures;Journal of Vacuum Science & Technology A;2023-02-27

5. Integration of silicon chip microstructures for in-line microbial cell lysis in soft microfluidics;Lab on a Chip;2023

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