Interfacial mechanism studies of electroless plated Cu films on a-Ta:N layers catalyzed by PIII-Reference-Cited by-同舟云学术

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Interfacial mechanism studies of electroless plated Cu films on a-Ta:N layers catalyzed by PIII

Published:2002-05 Issue:3 Volume:20 Page:733-740
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Lin Jian-Hong,Lee Tzu-Li,Hsieh Wei-Jen,Lin Chien-Cheng,Kou Chwung-Shan,Shih Han C.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.1465448

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3. Conductive and semi-transparent Cu thin film fabricated using molecular precursor solutions;Materials Letters;2015-02

4. The effect of inducing uniform Cu growth on formation of electroless Cu seed layer;Thin Solid Films;2014-08

5. Conformal electroless filling of Cu into patterned amorphous carbon layer modified by oxygen plasma and aminosilane treatments;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2010-07

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