Affiliation:
1. Evolving Nano Process Infrastructure Development Center, Inc., 16-1 Onogawa, Tsukuba-shi, Ibaraki-ken 305-8569, Japan
Subject
Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials
Cited by
7 articles.
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1. Role of landing energy in e-beam metrology of thin photoresist for high-numerical aperture extreme ultraviolet lithography;Journal of Micro/Nanopatterning, Materials, and Metrology;2022-12-10
2. Low-voltage aberration-corrected SEM metrology of thin resist for high-NA EUVL;Metrology, Inspection, and Process Control XXXVI;2022-05-26
3. Precision fabrication of EUVL programmed defects with helium ion beam patterning;Journal of Micro/Nanopatterning, Materials, and Metrology;2021-04-27
4. Development of standard samples with programmed defects for evaluation of pattern inspection tools for 7-nm and smaller nodes;Journal of Micro/Nanolithography, MEMS, and MOEMS;2019-09-13
5. Standard wafer with programed defects to evaluate the pattern inspection tools for 300-mm wafer fabrication for 7-nm node and beyond;Journal of Micro/Nanolithography, MEMS, and MOEMS;2019-06-19