Patterning of Cu, Co, Fe, and Ag for magnetic nanostructures-Reference-Cited by-同舟云学术

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Patterning of Cu, Co, Fe, and Ag for magnetic nanostructures

Published:1997-05 Issue:3 Volume:15 Page:1780-1784
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Jung K. B.,Lee J. W.,Park Y. D.,Caballero J. A.,Childress J. R.,Pearton S. J.,Ren F.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.580869

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Etching of Ag and Au films in CH4-based plasmas at low temperature;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2015-01

2. Chemical Etching and Patterning of Copper, Silver, and Gold Films at Low Temperatures;ECS Journal of Solid State Science and Technology;2014-10-29

3. Multilayer transparent electrode consisting of silver alloy layer and metal oxide layers for organic luminescent electronic display device;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2008-05

4. P-4: Metal Contact Improvement in Cu-gate TFT-LCD;SID Symposium Digest of Technical Papers;2007-05

5. Etching of Copper Films for Thin Film Transistor Liquid Crystal Display using Inductively Coupled Chlorine-Based Plasmas;Japanese Journal of Applied Physics;2004-12-09

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