Effects of argon pressure and substrate temperature on the structure and properties of sputtered copper films
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Published:1981-07
Issue:2
Volume:19
Page:205-215
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ISSN:0022-5355
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Container-title:Journal of Vacuum Science and Technology
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language:en
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Short-container-title:Journal of Vacuum Science and Technology
Author:
Craig S.,Harding G. L.
Publisher
American Vacuum Society
Subject
General Engineering
Cited by
109 articles.
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