Author:
Hu C.‐K.,Canney B.,Pearson D. J.,Small M. B.
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Inductively coupled plasma reactive ion etching of copper thin films using ethylenediamine/butanol/Ar plasma;Vacuum;2020-11
2. Metallization;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22
3. Dry Etching of Electronic Oxides, Polymers, and Semiconductors;Plasma Processes and Polymers;2005-01-12
4. Impact of plasma processing on integrated circuit technology migration: From 1 μm to 100 nm and beyond;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2003-09
5. Plasma Chemistry;Wiley Encyclopedia of Electrical and Electronics Engineering;1999-12-27