Damage of ultralow k materials during photoresist mask stripping process-Reference-Cited by-同舟云学术

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Damage of ultralow k materials during photoresist mask stripping process

Published:2006 Issue:3 Volume:24 Page:1238
ISSN:1071-1023
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:en
Short-container-title:J. Vac. Sci. Technol. B

Author:

Hua Xuefeng,Kuo Ming-shu,Oehrlein G. S.,Lazzeri P.,Iacob E.,Anderle M.,Inoki C. K.,Kuan T. S.,Jiang P.,Wu Wen-li

Publisher

American Vacuum Society

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

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