Study of process parameters and characteristics properties of W coatings deposited by rf plasma sputtering-Reference-Cited by-同舟云学术

Study of process parameters and characteristics properties of W coatings deposited by rf plasma sputtering

Published:2023-04-24 Issue:3 Volume:41 Page:
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B
language:en
Short-container-title:

Author:

Vassallo Espedito¹^ORCID,Pedroni Matteo¹^ORCID,Aloisio Marco¹^ORCID,Minelli Daniele¹^ORCID,Nardone Antonio¹^ORCID,Chen Hao²³⁴⁵^ORCID,Pietralunga Silvia Maria⁴⁵^ORCID,Stinchelli Andrea⁴⁶^ORCID,Di Fonzo Fabio⁴^ORCID

Affiliation:

1. CNR, Institute for Plasma Science and Technology 1 , Via R. Cozzi 53, Milan 20125, Italy

2. Physics Department, Politecnico di Milano 2 P.zza Leonardo da Vinci 32, Milan 20133, Italy

3. , 2 P.zza Leonardo da Vinci 32, Milan 20133, Italy

4. Center for Nano Science and Technology @PoliMi, Istituto Italiano di Tecnologia 3 , Via Rubattino 81, Milan 20134, Italy

5. CNR, Institute for Photonics and Nanotechnologies 4 , P.zza Leonardo da Vinci 32, Milan 20133, Italy

6. Energy Department, Politecnico di Milano 5 , Via Ponzio 34/3, Milano 20133, Italy

Abstract

Tungsten coatings were deposited on silicon substrates by radio frequency (rf) magnetron sputtering from a metallic target in Ar atmosphere. The process parameters during the sputtering process were evaluated by a Langmuir probe, particularly, the electron density and electron temperature were measured by changing the rf power and gas pressure. The morphological and structural properties of the coatings were studied as a function of the pressure. Significant correlations were found between process parameters and characteristics properties of W coatings. The influence of deposition parameters on electrical properties was investigated. The electrical resistivity of the coatings was increased from 1.3 × 10−6 to 3 × 10−5 Ω m as the pressure increased as well.

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

https://pubs.aip.org/avs/jvb/article-pdf/doi/10.1116/6.0002377/18276204/032802_1_6.0002377.pdf

Reference46 articles.

1. Residual stress, microstructure, and structure of tungsten thin films deposited by magnetron sputtering

2. Development of Quality Tungsten Coating on Ceramics as a Microwave Shield for ITER High-Frequency Magnetic Sensor

3. Diffusion barrier properties of thin selective chemical vapor deposited tungsten films

4. Selective W for Coating and Releasing MEMS Devices

5. Electrical contact resistance of tungsten coatings deposited on Cu and Al conductors