Thermal stability of a Ti-Si-N diffusion barrier in contact with a Ti adhesion layer for Au metallization
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Published:1999
Issue:1
Volume:17
Page:166
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ISSN:0734-211X
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Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
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language:en
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Short-container-title:J. Vac. Sci. Technol. B
Author:
Shalish I.,Shapira Yoram
Publisher
American Vacuum Society
Subject
General Engineering
Cited by
9 articles.
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