Profile control of high aspect ratio trenches of silicon. I. Effect of process parameters on local bowing-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Profile control of high aspect ratio trenches of silicon. I. Effect of process parameters on local bowing

Published:2002 Issue:4 Volume:20 Page:1508
ISSN:0734-211X
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:en
Short-container-title:J. Vac. Sci. Technol. B

Author:

Boufnichel M.,Aachboun S.,Grangeon F.,Lefaucheux P.,Ranson P.

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 85 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of the influence of hardmask morphology on bowing effect in nano-scale silicon plasma etching process;Advanced Etch Technology and Process Integration for Nanopatterning XIII;2024-04-09

2. The Influence of Etching Sequence on Morphology in Deep Silicon Etching;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

3. The study and optimization of ICP deep etching at a low-temperature for InP solid-immersion metalens fabrication;Materials Science in Semiconductor Processing;2023-11

4. Sustainable Approach for the Development of TiO2-Based 3D Electrodes for Microsupercapacitors;Batteries;2023-04-29

5. Cryogenic etching of silicon compounds using a CHF3 based plasma;Journal of Applied Physics;2023-03-21

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP