Low Temperature Diffusion in Polycrystalline Thin-Film Gold–Nickel Couples-Reference-Cited by-同舟云学术

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Low Temperature Diffusion in Polycrystalline Thin-Film Gold–Nickel Couples

Published:1969-07 Issue:4 Volume:6 Page:644-647
ISSN:0022-5355
Container-title:Journal of Vacuum Science and Technology
language:en
Short-container-title:Journal of Vacuum Science and Technology

Author:

Richards J. L.,McCann W. H.

Publisher

American Vacuum Society

Subject

General Engineering

Link

http://avs.scitation.org/doi/pdf/10.1116/1.1315716

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-temperature application of the low-emissivity Au/Ni films on alloys;Applied Surface Science;2010-09

2. Microstructural investigation of oxidized Ni/Au ohmic contact to p-type GaN;Journal of Applied Physics;1999-10

3. The effect of gold-nickel metallization microstructure on fluxless soldering;Journal of Electronic Materials;1994-06

4. Interdiffusion Studies of Au/Ni and Au/Ni‐P;Journal of The Electrochemical Society;1980-05-01

5. A controlled‐atmosphere electron‐microscopy study of the influence of oxygen on the interdiffusion of gold and iron;Applied Physics Letters;1977-04-15

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