The copper–silicon interface: Composition and interdiffusion-Reference-Cited by-同舟云学术

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The copper–silicon interface: Composition and interdiffusion

Published:1988-05 Issue:3 Volume:6 Page:1012-1016
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Corn Stewart H.,Falconer John L.,Czanderna A. W.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.575620

Cited by 58 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Understanding substrate-driven growth mechanism of copper silicide nanoforms and their applications;Materials Science and Technology;2023-04-12

4. CuNPs-loaded amines-functionalized-SBA-15 as effective catalysts for catalytic reduction of cationic and anionic dyes;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2021-08

5. Discovery of mono(u-oxo)dicopper and bis(u-oxo)dicopper in ordered Cu incorporated in SBA-15 via sol-gel process from silatrane at room temperature: An in situ XAS investigation;Microporous and Mesoporous Materials;2020-07

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