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Efficacy of boron nitride encapsulation against plasma-processing of 2D semiconductor layers

  • Published:2021-05 Issue:3 Volume:39 Page:032201
  • ISSN:0734-2101
  • Container-title:Journal of Vacuum Science & Technology A
  • language:en
  • Short-container-title:Journal of Vacuum Science & Technology A

Author:

Kumar Pawan12ORCID,Figueroa Kelotchi S.3,Foucher Alexandre C.2,Jo Kiyoung1,Acero Natalia4,Stach Eric A.25ORCID,Jariwala Deep1ORCID

Affiliation:

1. Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104

2. Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104

3. Department of Physics and Electronics, University of Puerto Rico, Humacao, Puerto Rico 00791

4. Vagelos Integrated Program for Energy Research, University of Pennsylvania, Philadelphia, Pennsylvania 19104

5. Laboratory for Research on the Structure of Matter, University of Pennsylvania, Philadelphia, Pennsylvania 19104

Funder

National Science Foundation

Army Research Office

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

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