Redistribution phenomena in aluminum alloy/titanium thin films-Reference-Cited by-同舟云学术

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Redistribution phenomena in aluminum alloy/titanium thin films

Published:1989-05 Issue:3 Volume:7 Page:1568-1572
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Slusser George J.,Ryan James G.,Shore Susan E.,Lavoie Mark A.,Sullivan Timothy D.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.576094

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bonding by Self-Propagating Reaction;Materials Research Foundations;2019-03-15

2. Effects of thermal treatment on microstructure of rapidly solidified Al–2.1at.% Mn alloy studied by RBS technique;Journal of Alloys and Compounds;2009-06

3. Nanoscale analysis on interfacial reactions in Al–Si–Cu alloys and Ti underlayer films;Journal of Applied Physics;2003-01-15

4. Interfacial Reactions in Al-Alloy/Ti/Silicon-Dioxide-Based Substrate Structures for Multilayered Interconnects;Japanese Journal of Applied Physics;1995-09-15

5. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines;IBM Journal of Research and Development;1995-07

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