Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process-Reference-Cited by-同舟云学术

Spectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching process

Published:2019-11 Issue:6 Volume:37 Page:062205
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B
language:en
Short-container-title:Journal of Vacuum Science & Technology B

Author:

Bauer Joachim¹,Fursenko Oksana²,Marschmeyer Steffen²,Heinrich Friedhelm¹,Villasmunta Francesco¹²³,Villringer Claus¹,Zesch Christoph¹,Schrader Sigurd¹

Affiliation:

1. Technical University of Applied Sciences Wildau, Hochschulring 1, 15745 Wildau, Germany

2. IHP—Leibniz-Institut für innovative Mikroelektronik, Im Technologiepark 25, 15236 Frankfurt (Oder), Germany

3. Department of Industrial Engineering, University of Rome, Tor Vergata, 00133 Rome, Italy

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://avs.scitation.org/doi/pdf/10.1116/1.5120617

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