Correlation between resistance behavior and mass transport in Al–Si/Ti multilayer interconnects
Author:
Publisher
American Vacuum Society
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://avs.scitation.org/doi/pdf/10.1116/1.574254
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Electromigration in ULSI interconnects;Materials Science and Engineering: R: Reports;2007-10
2. Additional microstructural analysis on the samples examined in the paper ‘Are high resolution resistometric methods really useful for the early detection of electromigration damage?’;Microelectronics Reliability;1999-04
3. Evaluation of adhesion strength of Ti films on Si(100) by the internal stress method;Thin Solid Films;1998-04
4. Adhesion measurement of Ti thin films on Si substrate using internal stress in overcoated Ni films;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1994-01
5. Electromigration in thin-films for microelectronics;Microelectronics Reliability;1993-09
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