Stability Analysis of Carbon Nanotube Interconnects-Reference-Cited by-同舟云学术

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Stability Analysis of Carbon Nanotube Interconnects

Published:2016-10-13 Issue: Volume: Page:11-19
ISSN:2194-5357
Container-title:Proceedings of 2nd International Conference on Intelligent Computing and Applications
language:
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Author:

Kumar Mekala Girish,Agrawal Yash,Chandel Rajeevan

Publisher

Springer Singapore

Link

http://link.springer.com/content/pdf/10.1007/978-981-10-1645-5_2

Reference16 articles.

1. Chandel, R., Sarkar, S., Agarwal, R.P.: An analysis of interconnect delay minimization by low-voltage repeater insertion. Microelectron. J. 38, 649–655 (2007)

2. Wen, W., Brongersma, S.H., Hove, M.V., Maex, K.: Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions. Appl. Phys. Lett. 84, 3238–3240 (2004)

3. Goel, A.K.: High-speed VLSI Interconnections. Wiley-IEEE Press, New York (2007)

4. Li, H., Xu, C., Srivastava, N., Banerjee, K.: Carbon nanomaterials for next-generation interconnects and passives: physics, status, and prospects. IEEE Trans. Electron Devices 56, 1799–1821 (2009)

5. McEuen, P.L., Fuhrer, M.S., Park, H.: Single-walled carbon nanotube electronics. IEEE Trans. Nanotechnol. 1, 78–85 (2002)

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modelling and Analysis of Copper and Carbon Nanotube VLSI Interconnects;Interconnect Technologies for Integrated Circuits and Flexible Electronics;2023-09-22

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