SMT Component Defection Reassessment Based on Siamese Network
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Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-9195-0_7
Reference14 articles.
1. Akhtar, M.B.: The use of a convolutional neural network in detecting soldering faults from a printed circuit board assembly. HighTech Innov. J. 3(1), 1–14 (2022)
2. Shah, R., Säckinger, E., et al.: Signature verification using a “siamese’’ time delay neural network. Int. J. Pattern Recogn. Artif. Intell. 07(4), 669 (1993)
3. Chin, R.T., Harlow, C.A., et al.: Automated visual inspection: a survey. IEEE Trans. Pattern Anal. Mach. Intell. PAMI-4(6), 557–573 (1982)
4. Lecture Notes in Computer Science;L Bertinetto,2016
5. Chang, Y.M., Wei, C.C., Chen, J., et al.: Classification of solder joints via automatic mistake reduction system for improvement of AOI inspection. In: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), pp. 150–153. IEEE (2018)
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