Effect of Fe3O4 Nanoparticle on Electronic Cooling: Numerical Investigation of Nanofluid Flow Through a Heat Sink
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-97-1916-7_7
Reference13 articles.
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3. Sharma CS, Zimmermann S, Tiwari MK, Michel B, Poulikakos D (2012) Optimal thermal operation of liquid-cooled electronic chips. Int J Heat Mass Transf 55(7–8):1957–1969
4. Faraji H, Yıldız Ç, Arshad A, Arıcı M, Choukairy K, El Alami M (2023) Passive thermal management strategy for cooling multiple portable electronic components: hybrid nanoparticles enhanced phase change materials as an innovative solution. J Energy Storage 70
5. Zhao N, Guo L, Qi C, Chen T, Cui X (2019) Experimental study on thermo-hydraulic performance of nanofluids in CPU heat sink with rectangular grooves and cylindrical bugles based on exergy efficiency. Energy Convers Manag 181:235–246
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