1. The International Technology Roadmap for Semiconductors (ITRS): Emerging Research Devices. http://www.itrs2.net (2015) http://www.itrs2.net/itrs-reports.html
2. The International Technology Roadmap for Semiconductors (ITRS) 2.0 Executive Summary. http://www.itrs2.net/itrs-reports.html
3. M. Koyanagi, T. Fukushima, T. Tanaka, Proc. IEEE 97(1), 49 (2009). https://doi.org/10.1109/JPROC.2008.2007463
4. P.A.T. adn, X. Gu, R. Alapati, M.S. Bakir, IEEE Trans. Components, Packaging Manuf. Technolo. 6(7), 1007 (2016). https://doi.org/10.1109/TCPMT.2016.2524691
5. T. Tanaka, M. Helm, T. Vali, R. Ghodsi, K. Kawai, J.K. Park, S. Yamada, F. Pan, Y. Einaga, A. Ghalam, T. Tanzawa, J. Guo, T. Ichikawa, E. Yu, S. Tamada, T. Manabe, J. Kishimoto, Y. Oikawa, Y. Takashima, H. Kuge, M. Morooka, A. Mohammadzadeh, J. Kang, J. Tsai, E. Sirizotti, E. Lee, L. Vu, Y. Liu, H. Choi, K. Cheon, D. Song, D. Shin, J.H. Yun, M. Piccardi, K.F. Chan, Y. Luthra, D. Srinivasan, S. Deshmukh, K. Kavalipurapu, D. Nguyen, G. Gallo, S. Ramprasad, M. Luo, Q. Tang, M. Incarnati, A. Macerola, L. Pilolli, L.D. Santis, M. Rossini, V. Moschiano, G. Santin, B. Tronca, H. Lee, V. Patel, T. Pekny, A. Yip, N. Prabhu, P. Sule, T. Bemalkhedkar, K. Upadhyayula, C. Jaramillo, in 2016 IEEE International Solid-State Circuits Conference (ISSCC) (2016), pp. 142–144. https://doi.org/10.1109/ISSCC.2016.7417947