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Reference29 articles.
1. Morris, J.W., Jr., Freer Goldstein, J.L., Mei, Z.: Microstructure and mechanical properties of tin-indium and tin-bismuth solders. JOM 45, 25–27 (1993)
2. Moelans, N., Hari Kumar, K.C., Wollants, P.: Thermodynamic optimization of the lead-free solder system Bi-In-Sn-Zn. J. Alloys Compd. 360, 98–106 (2003)
3. Gnecco, F., et al.: Wetting behaviour and reactivity of lead free Au-In-Sn and Bi-In-Sn alloys on copper substrates. J. Adhes. Adhesiv 27, 409–416 (2007)
4. Kleppa, O.J.: The thermodynamic properties of the moderately dilute liquid solutions of copper, silver, and gold in thallium, lead, and bismuth. J. Phys. Chem. 60, 446–452 (1956)
5. Wittig, F.E., Scheidt, P.: Energetics of metallic systems. XIV. Heats of mixing in the binary systems of indium and thallium with tin and lead. Z. Phys. Chem. 28, 120–142 (1961)