Source/Drain (S/D) Spacer-Based Reconfigurable Devices-Advantages in High-Temperature Applications and Digital Logic
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Publisher
Springer Singapore
Link
http://link.springer.com/content/pdf/10.1007/978-981-15-4775-1_48
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3. Martino MDV, Neves FS, Agopian PGD, Martino JA, Vandooren A, Rooyackers R, Simoen E, Thean A, Claeys C (2015) Analog performance of vertical nanowire TFETs as a function of temperature and transport mechanism. Solid-State Electron 112:51–55
4. Madan J, Chaujar R, Temperature associated reliability issues of heterogeneous gate dielectric—gate all around—tunnel FET. IEEE Trans Nanotechnol 99:1. https://doi.org/10.1109/tnano.2017.2650209
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