Laser Micromachining of Semiconductor Materials
Author:
Singh S.,Samuel G. L.
Publisher
Springer Singapore
Reference22 articles.
1. Bovatsek, J.M., Patel, R.S.: Highest-speed dicing of thin silicon wafers with nanosecond-pulse 355 nm q-switched laser source using line-focus fluence optimization technique. Laser-based Micro-and Nanopackaging and Assembly IV, 23 Feb 2010 2. Charee, W., Tangwarodomnukun, V., Dumkum, C.: Ultrasonic-assisted underwater laser micromachining of silicon. J. Mater. Process. Technol. 231, 209–220 (2016) 3. Ding, P.J., Liu, Q.C., Lua, X., Liu, X.L., Sun, S.H., Liu, Z.Y., Hua, B.T., Li, Y.H.: Hydrodynamic simulation of silicon ablation by ultrashort laser irradiation. Nucl. Instrum. Methods Phys. Res. B 286, 40–44 (2012) 4. Dong, Y., Molian, P.: Femtosecond pulsed laser ablation of 3C–SiC thin film on silicon. Appl. Phys. A Mater. Sci. Process. 77, 839–846 (2003) 5. Finn, D.S., Lin, Z., Kleinert, J., Darwin, M.J., Zhang, H.: Study of die break strength and heat-affected zone for laser processing of thin silicon wafers. 27(3), 032004(1–8) (2015)
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