Comparison of EM Performances in Circuit and Test Structures
Author:
Tan Cher Ming,He Feifei
Publisher
Springer Singapore
Reference13 articles.
1. Baker RJ (2004) CMOS circuit design layout and simulation, Revised 2nd edn. IEEE Press Series on microelectronic Systems, Wiley, NY
2. He F, Tan CM (2012) Comparison of electromigration simulation in test structure and actual circuit. Appl Math Model 36:4908–4917
3. Lin M, Jou N, Liang JW, Su KC (2009) Effect of multiple via layout on electromigration performance and current density distribution in copper interconnect. In: IEEE International Reliability Physics Symposium, 2009, pp 844–847
4. Lin MH, Lin YL, Chang KP, Su KC, Wang T (2006) Copper interconnect electromigration behavior in various structures and precise bimodal fitting. Jap J Appl Phys Part 1 45(2A):700–709
5. Chen CT, Hsu T-S, Jeng R-J, Yeh H-C (2000) Enhancing the glass-transition temperature of polyimide copolymers containing 2,2-bipyridine units by the coordination of nickel malenonitriledithiolate. J Polymer Sci, Part A: Polymer Chem 38(3):498–503