Finite Element Modeling of Nano Porous Sintered Silver Material-Reference-Cited by-同舟云学术

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Finite Element Modeling of Nano Porous Sintered Silver Material

Published:2020 Issue: Volume: Page:55-67
ISSN:2195-4356
Container-title:Lecture Notes in Mechanical Engineering
language:
Short-container-title:

Author:

Meyghani Bahman,Emamian S.,Awang Mokhtar,Wu Chuan Song

Publisher

Springer Singapore

Link

https://link.springer.com/content/pdf/10.1007/978-981-15-5753-8_6

Reference26 articles.

1. Bai JG, Zhang ZZ, Calata JN, Lu G-Q (2006) Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material. IEEE Trans Compon Packag Technol 29:589–593

2. Scheuermann U (2009) Reliability challenges of automotive power electronics. Microelectron Reliab 49:1319–1325

3. Ghoushji M, Alebrahim R, Zulkifli R, Sulong A, Abdullah S, Azhari C (2018) Crashworthiness characteristics of natural ramie/bio-epoxy composite tubes for energy absorption application. Iran Polym J, 1–13

4. Schwarzbauer H (1989) Method of securing electronic components to a substrate. Google Patents

5. Schwarzbauer H (1990) Method and apparatus for fastening electronic components to substrates. Google Patents

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Porosity on Thermal Resistance Aging at Submicron Silver Interfaces;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Arbitrary Lagrangian–Eulerian (ALE) Method;Welding Simulations Using ABAQUS;2022

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