Effects of Porosity on Thermal Resistance Aging at Submicron Silver Interfaces-Reference-Cited by-同舟云学术

Effects of Porosity on Thermal Resistance Aging at Submicron Silver Interfaces

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Wang Jian¹,Zhang Mowen¹,Yang Chao¹,He Zhiyuan²,Fu Zhiwei³,Yang Jia-Yue⁴

Affiliation:

1. Shandong University Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,School of Energy and Power Engineering,Jinan,China

2. Physics and Application of Electronic Component Laboratory,Science and Technology on Reliability,Guangzhou,China

3. Shandong University Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEPREI,School of Energy and Power Engineering,Guangzhou,China

4. Shandong University Optics & Thermal Radiation Research Center, Institute of Frontier and Interdisciplinary Science, Shandong University,School of Energy and Power Engineering,Jinan,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492418.pdf?arnumber=10492418

Reference14 articles.

1. Reliability of nano-silver soldering paste with high thermal conductivity

2. Porosity effect on fatigue life of sintered silver during thermal cycling

3. Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver

4. A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications

5. Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles