A Parametric CFD Study on the Cooling Capability of a Rectangular Channel Heat Sink
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Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-2091-2_22
Reference5 articles.
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3. Tuckerman, D., Pease, R.: High-performance heat sinking for VLSI. Electron Device Letters, IEEE 2, 126 – 129 (06 1981). https://doi.org/10.1109/EDL.1981.25367
4. Turek, L.J., Rini, D.P., Saarloos, B.A., Chow, L.C.: Evaporative spray cooling of power electronics using high temperature coolant. In: 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. pp. 346–351. IEEE (2008)
5. Wu, R., Yiwen, F., Hong, T., Zou, H., Hu, R., Luo, X.: An immersed jet array impingement cooling device with distributed returns for direct body liquid cooling of high power electronics. Applied Thermal Engineering 162, 114259 (08 2019). https://doi.org/10.1016/j.applthermaleng.2019.114259
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