Effect of Surface-Treated Filler on the Wettability of Composite Solder: Short Review
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-9267-4_86
Reference39 articles.
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3. M.K. Pal, G. Gergely, D. Koncz-Horváth, Z. Gácsi, Investigation of microstructure and wetting behavior of Sn–3.0 Ag–0.5 Cu (SAC305) lead-free solder with additions of 1.0 wt% SiC on copper substrate. 128, 106991 (2021)
4. W. Yang, H. Araki, C. Tang, S. Thaveethavorn, A. Kohyama, H. Suzuki, T. Noda, Single‐crystal SiC nanowires with a thin carbon coating for stronger and tougher ceramic composites. 17(12), 1519–1523 (2005)
5. M.K. Pal, G. Gergely, D. Koncz-Horváth, Z.J.P.M. Gácsi, M. Ceramics, Investigation of the electroless nickel plated sic particles in sac305 solder matrix. 58(9), 529–537 (2020)
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